猜忌 发表于 2025-3-25 04:33:36
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Power Profiling-Guided Floorplanner for Thermal Optimization in 3D Multiprocessor Architectures,uces power consumption by decreasing global wire length. However, 3D integration causes serious thermal problems since the closer proximity of heat generating dies makes existing thermal hotspots more severe. Thermal-aware floorplanners can play an important role to improve the thermal profile, but–吃 发表于 2025-3-25 15:11:09
A System Level Approach to Multi-core Thermal Sensors Calibration,o their high power densities. Thermal sensors and feedback strategies are used to reduce these threats but sensor accuracy directly impact control performance. In this paper we propose a novel technique to calibrate thermal sensors. Our approach can be applied to general multi-core platforms since i新奇 发表于 2025-3-25 19:14:44
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Pass Transistor Operation Modeling for Nanoscale Technologies,. The different regions of operation are determined and the differential equation which describes the pass transistor operation is solved analytically. Appropriate approximations about the current waveforms are used simplifying the modeling procedure without significant influence on the accuracy. Th等待 发表于 2025-3-26 04:33:55
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Performance-Driven Clustering of Asynchronous Circuits,us pipeline stages while preserving liveness, meeting throughput constraints, and minimizing area. The method enables a form of automatic re-pipelining in which the throughput of the resulting design is not limited to the clock frequency or the level of pipelining in the original RTL specification.