开始没有
发表于 2025-3-23 11:26:18
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BRAND
发表于 2025-3-23 15:44:12
https://doi.org/10.1007/978-3-319-08198-4Poisson algebra on the two sphere; SU(2)-invariant quantum systems; dequantization; quantum-classical s
尾随
发表于 2025-3-23 19:10:24
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anthropologist
发表于 2025-3-24 02:02:24
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臭名昭著
发表于 2025-3-24 04:49:34
https://doi.org/10.1007/978-94-007-2454-9ed on the paradigm of Service-Oriented Architectures and Semantic Web technology. We hereby envision a direct, but implicit link from a business analyst’s view on a process model to its execution driven by an IT system. This linkage enables the derivation of an execution-level model for newly create
憎恶
发表于 2025-3-24 06:48:03
Surfactants Containing Hydrolyzable Bondshuge impact on internet penetration in rural parts of Africa. We first give an overview on TVWS, its use cases and highlight possible challenges against its uptake. Then we describe our carrier-grade wireless back-hauling solution (WiBACK) and discuss its capability for working with a geolocation da
Myocarditis
发表于 2025-3-24 12:00:44
Eric Bodden,Kevin Falzon,Ka I. Pun,Volker Stolzan planning and intercultural theory. In recent years, demographic changes in cities in many parts of the world have led to increasing concerns about inter-ethnic tensions, social inequality, and racial discrimination. By virtue of their intermediate status, cities are in a particularly good positio
终点
发表于 2025-3-24 18:12:43
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surrogate
发表于 2025-3-24 20:11:20
S. B. Filippov,V. S. Sabaneevstems from other systems, and about the two key topics of semantics: meaning and reference. The paper focuses on the emergence of reference and how this is connected with individuation, reification and the notion of an object. Objects have three features that are crucial for reference: First: They a
PAGAN
发表于 2025-3-25 01:18:57
Maxime Audouin,Matthias Fingernce for courses in RFIC and mixed signal ICs, and for designSubstrate noise coupling in integrated circuits (ICs) is the process by which int- ference signals in the form of voltage and current glitches cause parasitic currents to ?ow in the silicon substrate to various parts of the IC. The source o