可扩大 发表于 2025-3-21 19:33:53

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Tailor 发表于 2025-3-21 23:02:42

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Obstreperous 发表于 2025-3-22 01:47:17

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直觉好 发表于 2025-3-22 05:01:40

U. Rückert,S. Rüping,E. Naroskaewer module or circuit card assemblies (CCAs) with greater electrical functions, which means that both the mechanical and electrical functional partitioning must be decided early in the design process.

起草 发表于 2025-3-22 10:46:23

José G. Delgado-Frias,William R. Moore of components considered highly electrostatic discharge (ESD)-sensitive is growing every year. Table 13-1 summarizes some existing data from various industry sources that shows the approximate range of static susceptibility for several different component types.

Heart-Rate 发表于 2025-3-22 14:34:03

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incredulity 发表于 2025-3-22 17:48:13

Book 1997Latest editionlso provides practical insight and will be of essential use tomanufacturing and process engineers in electronics and aerospacemanufacturing. In addition, electronics packaging engineers andelectronics manufacturing managers and supervisors will gain a wealthof knowledge.

共栖 发表于 2025-3-22 23:16:40

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典型 发表于 2025-3-23 05:13:10

A. M. M. Richardson,R. Swain,S. J. Smithngineering procedures in manufacturing processes and methods of production of industrial products. It requires the ability to plan the practices of manufacturing; to research and develop tools, processes, machines, and equipment; and to integrate the facilities and systems for producing quality prod

Delectable 发表于 2025-3-23 08:36:39

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查看完整版本: Titlebook: Handbook of Electronics Manufacturing Engineering; Bernard Matisoff Book 1997Latest edition Springer Science+Business Media Dordrecht 1997