VERT
发表于 2025-3-25 07:06:01
https://doi.org/10.1007/978-1-349-17714-1Shock and vibration start to become problems long before electronics equipment is installed. The designer must consider handling and transportation at the early stages of design in order to achieve factory-to-field dependability.
诱骗
发表于 2025-3-25 07:42:22
https://doi.org/10.1057/9780230100848Design of any equipment must employ features to protect personnel from electrical and mechanical hazards, and those dangers that may arise from fire, elevated operating temperatures, and toxic fumes.
GROG
发表于 2025-3-25 12:44:06
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使闭塞
发表于 2025-3-25 16:27:18
Electronics Packaging Design and Engineering,The electronics packaging design and engineering fields perform tasks of ever- increasing importance in the electronics industry. They can be either the strength or the weakness of electronics systems engineering. Much depends on how its purpose and functions are interpreted within the engineering organization.
坚毅
发表于 2025-3-25 23:44:55
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SENT
发表于 2025-3-26 02:19:43
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dainty
发表于 2025-3-26 07:42:46
Heat Transfer and Thermal Control,The field of high temperature control in Electronic Assemblies is, of course, too broad to be completely covered in this text. Nevertheless, this chapter is intended to establish a basic approach to a thermal study for any unit under consideration, and to obviate the minor problems often encountered in a thermal design.
洞穴
发表于 2025-3-26 12:17:47
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Autobiography
发表于 2025-3-26 12:44:36
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乐意
发表于 2025-3-26 19:49:21
Electrical Interconnection Systems,Electrical interconnection systems are the means of routing electrical power and signals to the various assemblies, subassemblies, and units of an electronic system.