积极词汇
发表于 2025-3-23 13:28:50
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BABY
发表于 2025-3-23 17:08:17
https://doi.org/10.1007/978-3-030-35020-8ectronic interfaces suitable for resistive sensors showing different variation ranges: small, as in dedicated-application GMR sensors; wide, especially referred to GMR sensing devices whose baseline is unknown. After a description of the main interface parameters, the authors present several solutio
Maximize
发表于 2025-3-23 21:05:40
Joyce A. Arditti,Casey M. McGregorese devices, and at room temperature, the resistance is a function of the external magnetic field, at optimal levels for being used as sensors. Since the GMR effect was reported, scientists and engineers have dedicated their effort to this topic. This way, after two decades, a a very good knowledge
appall
发表于 2025-3-24 02:12:12
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受辱
发表于 2025-3-24 02:57:54
Handbook on Craniofacial Superimposition and impacts, etc. Thus, components for space applications, which need to stand these hard conditions, are normally very expensive and it often takes a while to include emerging technologies in the space market. This means that space components are not always that innovative..The case of vector magn
Mechanics
发表于 2025-3-24 07:21:13
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sinoatrial-node
发表于 2025-3-24 11:57:10
Tríona Hourigan,Ann Marcus-Quinnity of detecting and estimating magnetic fluid weight density in vivo. In this chapter, a uniquely designed GMR needle probe is presented for the detection and estimation of magnetic fluid content density inside tumors. Experimental results showed that the proposed technique has a good potential to
比目鱼
发表于 2025-3-24 16:40:20
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Ordnance
发表于 2025-3-24 21:36:26
Spintronic Phenomena: Giant Magnetoresistance, Tunnel Magnetoresistance and Spin Transfer Torque,esistance and spin transfer torque.This presentation aims at describing the concepts in the simplest way by recalling their historical development. The correlated technical improvements mostly concerning material issues are also described showing their evolution with time.
一个姐姐
发表于 2025-3-25 02:02:20
Microfabrication Techniques,and encapsulation steps are found in both parts. However, characteristics related to the specific materials involved in the GMR technology recommend the use of some particular techniques. In this chapter, we focus on these specific methods, while keeping in mind the interest in merging standard CMOS