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Die Stress Measurement Using Piezoresistive Stress Sensors,ology. In the case of integrated circuit (IC) packages, stress can be produced either through the die attachment process or through encapsulation in a molding material. In the case of chip-on-board (COB) packaging, stress can be produced by the chip coating used to protect the IC against handling da凹槽 发表于 2025-3-26 06:49:35
2520-1476 ritical research on school and policy design.Examines issuesThis book addresses the relationship between the production of social problems in educational policy, the research practices required to inform policy, and the daily production of normalcies and differences in school contexts. It reports on联邦 发表于 2025-3-26 09:04:01
Ausgewählte volkswirtschaftliche Daten invaluable tool for the detection of asymptomatic stones, as well as the prevention and/or detection of possible CBD injuries [.–.]. Regarding the latter, authors such as Wright [.] have suggested that IOC is not a prerequisite for the safe performance of laparoscopic cholecystectomy and cannot be relied upon to prevent all biliary injuries.最初 发表于 2025-3-26 15:15:32
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