constellation
发表于 2025-3-25 05:34:50
7楼
unstable-angina
发表于 2025-3-25 09:10:38
7楼
束以马具
发表于 2025-3-25 12:02:51
7楼
jagged
发表于 2025-3-25 18:17:11
7楼
thrombus
发表于 2025-3-25 21:11:27
8楼
杀死
发表于 2025-3-26 02:50:39
Thermal Stress Considerations in Die-Attachment,strate or a package using hard solder, soft solder, metal-filled epoxy, or glass.. The package together with the die-bonding layer serves the purposes of heat dissipation, mechanical support, and sometimes electrical conduction. With increasing power requirements of the chip, quality die-attach beco
不能和解
发表于 2025-3-26 07:48:38
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规章
发表于 2025-3-26 09:55:07
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啜泣
发表于 2025-3-26 15:05:48
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因无茶而冷淡
发表于 2025-3-26 20:34:30
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