boisterous
发表于 2025-3-23 13:08:47
第4楼
headlong
发表于 2025-3-23 15:42:27
第4楼
Torrid
发表于 2025-3-23 18:31:27
第4楼
Champion
发表于 2025-3-24 01:56:39
5楼
宿醉
发表于 2025-3-24 03:31:45
5楼
烧烤
发表于 2025-3-24 10:05:18
5楼
Peristalsis
发表于 2025-3-24 13:10:51
5楼
leniency
发表于 2025-3-24 15:26:03
6楼
帐单
发表于 2025-3-24 21:46:01
6楼
和音
发表于 2025-3-25 02:26:38
Jeffrey Yi-Lin Forrest,Yaoguo Dang,Larry McCarthy,Sifeng Liu,Yong Liu as a replacement for through-hole tech nology. The mounting of electronic devices and components onto the surface of a printed wiring board or other substrate offers many advantages over inserting the leads of devices or components into holes. From the engineering viewpoint, much higher lead count