CON
发表于 2025-3-26 21:41:32
Computer-Assisted Musculoskeletal Surgery much broader sense, to mean “things that were unexpected during design.” This chapter first categorizes the malfunction of the actual LSI chip then discusses the types of noise and their countermeasures. The noise discussed in this chapter includes PVT variation, power supply noise, substrate noise, cross-talk noise, and EMC.
cogent
发表于 2025-3-27 02:56:28
Aydin Azizi,Poorya Ghafoorpoor YazdiOther negative effects such as increase of the leakage current, electro migration, stress migration, hot carrier injection, NBTI and random telegraph noise are also discussed with their brief device physics.
Aspirin
发表于 2025-3-27 08:27:26
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健壮
发表于 2025-3-27 11:38:54
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淡紫色花
发表于 2025-3-27 16:15:53
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MURKY
发表于 2025-3-27 18:03:56
SPICE Simulation,t basic simulations in LSI design. This chapter introduces the principles of the SPICE simulation starting from modified nodal analysis which converts Kirchhoff’s Current Law into the circuit matrix form. It is expanded to circuits with nonlinear elements, AC analysis, then transient analysis. This
LURE
发表于 2025-3-27 22:15:25
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eczema
发表于 2025-3-28 03:07:18
Interconnect RC Extraction,e circuit designed for 5 GHz only runs at 3 GHz. What should you do.? Connecting wires have parasitic resistance and capacitance, and an RC extraction tool reads the layout data and generates the corresponding netlist with the interconnect resistance and capacitance. This chapter explains how RC ext
pellagra
发表于 2025-3-28 06:16:08
IO Buffers,ines on the circuit diagram, but it probably isn’t so easy in reality. When chips are connected to each other and signals are exchanged, the signal is output from the pad connected to the interior of the chip, which goes through the bonding wire, the lead frame of the package, and the transmission l
BLA
发表于 2025-3-28 12:33:42
Noise,t off as “noise is your problem.” Here, “noise” does not mean “constantly random fluctuations such as thermal noise,” but rather the word is used in a much broader sense, to mean “things that were unexpected during design.” This chapter first categorizes the malfunction of the actual LSI chip then d