intimate 发表于 2025-4-1 02:25:06
http://reply.papertrans.cn/31/3073/307247/307247_61.png嘲笑 发表于 2025-4-1 06:19:04
The Challenge in Packaging and Assembling the Advanced Power Amplifiers,ction temperature in the transistors can be maintained at a reasonable low level. This is necessary in order to prolong the life time of the transistor devices. Fig. 8.1 shows the predicted device life time versus the junction temperature for typical Si-based transistors as stress tested at 150 °C.伪造 发表于 2025-4-1 13:18:43
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