支架
发表于 2025-3-25 03:48:36
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synovitis
发表于 2025-3-25 10:59:34
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GLOSS
发表于 2025-3-25 12:15:23
3D Circuit Model Construction and Simulation,a method to construct a complete 3D circuit model is necessary and this chapter will illustrate the construction and the corresponding transient electro-thermo-structural simulations for the EM reliability assessment of an IC.
Fibroid
发表于 2025-3-25 17:49:15
Rita D. Sherma (Director),Arvind Sharma(EM) reliability of ICs is becoming increasingly important. As re-design and re-manufacture are very time- and resource-consuming for present-day, ultra large-scale integration (ULSI), “Design-for-Reliability,” is essential.
neutrophils
发表于 2025-3-25 20:25:37
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Trigger-Point
发表于 2025-3-26 04:01:45
: The Film World as Representation EM models in literature use the line-via test structures which are only part of the real circuit structure. To further demonstrate the necessity for complete circuit modeling, the comparison of the EM performances in a circuit structure and a standard line-via test structure is performed in this ch
GIBE
发表于 2025-3-26 05:42:32
M. A. Mohamed Salih,Bas Gaay de Fortmancuits consist of a large number of transistors and other circuit components connected by complex inter-block connections made of multiple metal layers. In this chapter, a complete 3D circuit model including both intra- and inter-block interconnects is constructed. Electro-thermo-structural simulatio
肉身
发表于 2025-3-26 10:51:27
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penance
发表于 2025-3-26 12:43:56
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无政府主义者
发表于 2025-3-26 20:02:33
Quantitative Brain SPECT in three Dimensionsrm. Studies using patient head CT (for the attenuation map), point-source measurement (for the resolution kernel), and the Hoffman brain phantom demonstrated accurate reconstruction by the enlarged uniform attenuation map (< 1% ROI error), as compared to the reconstruction using the true head attenuation map.