Horizon
发表于 2025-3-25 06:44:24
Electrochemistry and Electrodepositiony is discussed in order to yield an atomic-level image on phase formation. Various empirical aspects of metal deposition are also outlined, including code position modes and structural aspects of coating formation.
Spinous-Process
发表于 2025-3-25 10:02:31
Ultrathin LayersThis is followed with surface-limited redox replacement that also works on UPD principles. The next topic is the self-limiting deposition that is unrelated to UPD but also leading to layers of a few atomic layer thickness. Finally, atomic-scale imaging of the early phase of the metal deposition is summarized.
mortuary
发表于 2025-3-25 14:45:47
Compositionally Modulated and Multilayered Depositsr summarizes the electrochemical methods of the deposition of compositionally (or layered) metals. Multiple-bath and single-bath methods are detailed, while the influence of the codeposition mode of the metals to be plated is also analyzed.
Saline
发表于 2025-3-25 18:15:45
Nanocrystalline Depositscts of nanocrystallinity, peculiar features of several metallic elements and alloy groups are discussed. Special attention will be paid for electrochemical techniques used for the deposition of nanocrystalline metals.
冲突
发表于 2025-3-25 23:11:39
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单片眼镜
发表于 2025-3-26 04:11:24
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cancellous-bone
发表于 2025-3-26 07:39:56
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哄骗
发表于 2025-3-26 12:12:03
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TRAWL
发表于 2025-3-26 14:23:50
Internationale Marktbearbeitungistry to recent nanotechnologies. It is highlighted how electrochemical methods gained a role in processing of the nanosystems, making electrochemistry-based nanomanipulation methods an important part of the tool kit of today’s nanotechnology. The structure of the major part of the entire book and i
labyrinth
发表于 2025-3-26 20:08:02
https://doi.org/10.1007/978-3-8350-9360-7n electrochemistry monographs but that are necessary to bridge the gap between theoretical electrochemistry and plating practice. Basic crystallography is discussed in order to yield an atomic-level image on phase formation. Various empirical aspects of metal deposition are also outlined, including