BILL
发表于 2025-3-27 00:11:02
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的是兄弟
发表于 2025-3-27 01:57:24
Grundlagen des maschinellen Beweisenslow. When the parts are pressed together during the sealing process, the number and area of the single contact spots are increased according to the macroscopic elasticity or flexibility of the parts and the microhardness and plasticity of the surfaces, respectively.
态学
发表于 2025-3-27 07:36:37
Characterizations of Electrically Conductive Adhesives,ng makes use of a wide variety of polymer material classes to fulfill a diverse range of engineering uses such as adhesives, substrates (printed circuit boards), encapsulants, stress buffer coatings, and interlayer dielectrics.
Lime石灰
发表于 2025-3-27 09:57:59
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柱廊
发表于 2025-3-27 17:14:53
Book 2010urrently available, including lead-free solder and ECAs (Electrically Conductive Adhesives). The material presented focuses on the three ECA categories specifically, Isotropically Conductive Adhesives (ICAs) Anisotropically Conductive Adhesives/Films (ACA/ACF) and Nonconductive Adhesives/Films (NCA/
Infuriate
发表于 2025-3-27 21:25:02
Book 2010 nano techniques can be applied to conductive adhesives is discussed, including recent research and development of nano component adhesives/nano component films, their electrical properties, thermal performance, bonding pressure and assembly and reliability..
落叶剂
发表于 2025-3-28 00:33:22
Isotropically Conductive Adhesives (ICAs),operties of an ICA transform it from an insulator to a conductor. Percolation theory has been used to explain the electrical properties of ICA composites. At low filler concentrations, the resistivity of ICAs decreases gradually with increasing filler concentration.
成绩上升
发表于 2025-3-28 04:05:50
Intrinsically Conducting Polymers (ICPs), and development community. By now these polymers are showing commercial promise in such areas as power equipment, batteries, microelectronics, shielding against electromagnetic interference, and coatings, not to mention micromachines and adhesives
没花的是打扰
发表于 2025-3-28 09:12:48
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好忠告人
发表于 2025-3-28 12:48:09
earch and development of nano component adhesives/nano component films, their electrical properties, thermal performance, bonding pressure and assembly and reliability..978-1-4899-8307-7978-0-387-88783-8