可互换
发表于 2025-3-25 04:35:42
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RADE
发表于 2025-3-25 11:06:41
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神圣将军
发表于 2025-3-25 11:43:23
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推崇
发表于 2025-3-25 16:02:45
Chip Level Protection,voltage produced by the conduction path below the voltage that causes damage. Conducting the current and clamping the voltage are the key points to providing ESD protection. The goal is to minimize the current density and electric field in a device during the ESD event .
尊严
发表于 2025-3-25 20:15:38
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nettle
发表于 2025-3-26 01:22:09
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环形
发表于 2025-3-26 07:33:57
Failure Analysis Techniques,ent. Without failure analysis it is impossible to determine the cause of failure and implement corrective actions to prevent its reoccurrence. ESD related failures come from two primary sources. The first are failures produced by the ESD testers as a result of product classification. Part of a new p
GRIPE
发表于 2025-3-26 08:38:02
Environmental Protection,nmental Protection implements procedures and uses extra equipment whose purpose is to limit charge build up and control the discharge path. This form of protection is one of two essential means of providing an overall ESD protection strategy. The other technique is increasing circuit robustness and
管理员
发表于 2025-3-26 14:18:14
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Seizure
发表于 2025-3-26 18:24:50
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