Coagulant
发表于 2025-3-21 19:58:43
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诱拐
发表于 2025-3-21 22:51:11
System Guidelines,le-board and multiple-subassembly products, at what is termed the system level. Testability does not just happen; it must be planned from the top down, right from the beginning of the system specification and architecture determination phases of product design.
acrimony
发表于 2025-3-22 02:25:20
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Ceremony
发表于 2025-3-22 08:03:33
LSI/VLSI Board Level Guidelines, devices per PCB is not decreasing. Rather, the number of functions per PCB is increasing in order to meet marketing and application demands. The result is that the average 100-IC PCB is far more complex. As the complexity of assemblies increases, the cost to test them increases exponentially (see F
farewell
发表于 2025-3-22 09:05:30
LSI/VLSI ASIC Level Techniques,omer-specific ICs (CSICs) for virtually any application, it has become apparent that even more care will have to be taken during the component design stage in order to insure adequate testability and producibility of digital ICs themselves and of the networks they are assembled into. This proliferat
证明无罪
发表于 2025-3-22 16:24:05
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证明无罪
发表于 2025-3-22 20:22:53
Software Guidelines,d subassembly tests. Many also require interaction between system level designers and hardware and software engineers. Thus close cooperation and teamwork is necessary for software to be successfully testable.
Altitude
发表于 2025-3-23 00:48:56
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laceration
发表于 2025-3-23 04:11:39
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小画像
发表于 2025-3-23 08:32:30
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