hedonic
发表于 2025-3-23 09:57:11
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能量守恒
发表于 2025-3-23 17:47:27
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Ceramic
发表于 2025-3-23 20:24:00
https://doi.org/10.1007/978-3-642-20375-61.6. Properties of these materials, like dielectric constant, resistance to oxidation, hydrophobicity, thermal conductivity, Young’s modulus, etc., are enlisted and considered for integrating these ultra-low-k dielectrics with CNT interconnects. The challenges associated with integration are also discussed in this chapter.
ASTER
发表于 2025-3-23 22:45:47
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平息
发表于 2025-3-24 05:13:03
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散开
发表于 2025-3-24 09:34:19
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Glycogen
发表于 2025-3-24 14:20:00
their integration with CNT interconnects, and geometry-based crosstalk reduction techniques. This book will be useful for researchers and design engineers working on carbon nanotubes for interconnects for both 2D and 3D integrated circuits..978-981-15-8890-7978-981-15-8888-4
寄生虫
发表于 2025-3-24 18:41:41
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expository
发表于 2025-3-24 22:18:51
Design and Crosstalk Analysis in Carbon Nanotube Interconnects978-981-15-8888-4
可商量
发表于 2025-3-25 02:34:53
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