Inspection
发表于 2025-3-21 17:54:03
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监禁
发表于 2025-3-22 00:01:14
Introduction, Sect. 1.2. The losses in the conductor and the substrate are also explained. An overview of the evolution and progress of the on-chip inductor with a review on the integrated inductor design is presented in Sect. 1.3. The design complexity and performance issues are also discussed.
改进
发表于 2025-3-22 02:45:19
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乞丐
发表于 2025-3-22 06:19:54
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dysphagia
发表于 2025-3-22 10:55:18
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TERRA
发表于 2025-3-22 16:46:26
Brijesh Dongol,Luigia Petre,Graeme Smith Sect. 1.2. The losses in the conductor and the substrate are also explained. An overview of the evolution and progress of the on-chip inductor with a review on the integrated inductor design is presented in Sect. 1.3. The design complexity and performance issues are also discussed.
TERRA
发表于 2025-3-22 20:56:38
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冒号
发表于 2025-3-23 01:00:35
Book 2014 continuous innovation of high performance integrated passive devices. The challenges like low quality factor, design complexity, manufacturability, processing cost, etc., are studied with examples and specifics. Silicon on-chip inductor was first reported in 1990 by Nguyen and Meyer in a 0.8 μm sil
飞行员
发表于 2025-3-23 04:04:20
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addict
发表于 2025-3-23 07:14:57
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