obdurate 发表于 2025-3-21 16:27:16
书目名称DIY MEMS影响因子(影响力)<br> http://figure.impactfactor.cn/if/?ISSN=BK0260096<br><br> <br><br>书目名称DIY MEMS影响因子(影响力)学科排名<br> http://figure.impactfactor.cn/ifr/?ISSN=BK0260096<br><br> <br><br>书目名称DIY MEMS网络公开度<br> http://figure.impactfactor.cn/at/?ISSN=BK0260096<br><br> <br><br>书目名称DIY MEMS网络公开度学科排名<br> http://figure.impactfactor.cn/atr/?ISSN=BK0260096<br><br> <br><br>书目名称DIY MEMS被引频次<br> http://figure.impactfactor.cn/tc/?ISSN=BK0260096<br><br> <br><br>书目名称DIY MEMS被引频次学科排名<br> http://figure.impactfactor.cn/tcr/?ISSN=BK0260096<br><br> <br><br>书目名称DIY MEMS年度引用<br> http://figure.impactfactor.cn/ii/?ISSN=BK0260096<br><br> <br><br>书目名称DIY MEMS年度引用学科排名<br> http://figure.impactfactor.cn/iir/?ISSN=BK0260096<br><br> <br><br>书目名称DIY MEMS读者反馈<br> http://figure.impactfactor.cn/5y/?ISSN=BK0260096<br><br> <br><br>书目名称DIY MEMS读者反馈学科排名<br> http://figure.impactfactor.cn/5yr/?ISSN=BK0260096<br><br> <br><br>脱水 发表于 2025-3-21 22:40:00
NNCI,r more universities. For instance, one is at the University of Washington, but Oregon State University is a partner institute and has additional equipment and resources available. The included map shows where the sites are located. Equipment available at these facilities varies, so review the websitEuthyroid 发表于 2025-3-22 03:49:34
http://reply.papertrans.cn/27/2601/260096/260096_3.png武器 发表于 2025-3-22 06:27:10
MEMS Fabrication Process, the graphic that illustrates this basic process. You start with a silicon wafer and apply a photosensitive coating to it that is called photoresist. When you expose your coated wafer to UV light, the regions blocked by your glass mask (containing your pattern for that layer) are not exposed. Thus,冷峻 发表于 2025-3-22 11:47:08
Equipment,ated correctly to avoid damage, and there can be multiple users waiting for their turn on a piece of equipment at any given time. Thus, common sense equipment use policies have been enacted by the facilities. The following is taken from Washington Nanofabrication Facility’s users’ manual.Camouflage 发表于 2025-3-22 16:10:19
Designing for MEMS,n wafer as the build platform or machining it to be the final device. Everything discussed in this book has been used for subtractive processes, as the equipment available in the NNCI facilities is mainly designed for subtractive techniques.Camouflage 发表于 2025-3-22 17:07:42
Imaging and Metrology, to check the quality and integrity of your devices after each process. Just remember that some process steps, like a spin coat of photoresist, are light sensitive. Some rooms have darkroom-style amber lighting, but not all, so double-check where it is safe to transport your coated wafer.scrutiny 发表于 2025-3-22 23:07:33
http://reply.papertrans.cn/27/2601/260096/260096_8.png极深 发表于 2025-3-23 03:40:00
http://reply.papertrans.cn/27/2601/260096/260096_9.png向外才掩饰 发表于 2025-3-23 09:00:50
http://reply.papertrans.cn/27/2601/260096/260096_10.png