期刊书目 › ENGINEERING, ELECTRICAL & ELECTRONIC(工程，电气和电子) › SCIE期刊PROCEEDINGS OF THE IEEE 2024/2025影响因子:23.217 (P IEEE) (0018-9219). (ENGINEERING, ELECTRICAL & ELECTRONIC)(工程，电气和电

Apogee 发表于 2025-3-25 05:45:42

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信任 发表于 2025-3-25 08:07:00

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杀菌剂 发表于 2025-3-25 15:01:45

Submitted on: 14 July 2003.
Revised on: 27 July 2003.
Accepted on: 11 August 2003.
PROCEEDINGS OF THE IEEE---IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC

圆锥 发表于 2025-3-25 16:32:39

Submitted on: 09 July 2023.
Revised on: 30 July 2023.
Accepted on: 16 August 2023.
PROCEEDINGS OF THE IEEE

DAFT 发表于 2025-3-25 20:46:18

Submitted on: 22 August 2015.
Revised on: 20 September 2015.
Accepted on: 06 October 2015.
PROCEEDINGS OF THE IEEE---IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC

grotto 发表于 2025-3-26 02:08:27

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constellation 发表于 2025-3-26 07:35:04

Submitted on: 16 October 2008.
Revised on: 29 October 2008.
Accepted on: 14 November 2008.
PROCEEDINGS OF THE IEEE

使绝缘 发表于 2025-3-26 10:07:30

Submitted on: 18 February 2014.
Revised on: 20 March 2014.
Accepted on: 07 April 2014.
PROCEEDINGS OF THE IEEE---IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC

的阐明 发表于 2025-3-26 15:42:50

Submitted on: 23 November 2000.
Revised on: 01 December 2000.
Accepted on: 14 December 2000.
PROCEEDINGS OF THE IEEE

有助于 发表于 2025-3-26 20:21:20

Submitted on: 02 April 2018.
Revised on: 14 April 2018.
Accepted on: 01 May 2018.
PROCEEDINGS OF THE IEEE

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