Hectic 发表于 2025-3-26 21:49:23
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Validating Deep Sub-Micron Effects,n 4. Finally, in Sections 5, we experimentally validate the delay variation (Section 5.1) and signal integrity (Section 5.2) problems by means of SPICE simulations. In Section 6, we review some existing techniques to handle cross-talk.palliate 发表于 2025-3-27 07:03:47
shrink, a host of electrical problems like cross-talk, electromigration, self-heat, etc. are becoming important. Cross-talk is one of the major problems since it results in unpredictable design behavior. In particular, it can result in significant delay variation or signal integrity problems in a widapper 发表于 2025-3-27 13:30:57
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