BULK
发表于 2025-3-21 18:32:11
书目名称Conceptual Design of Multichip Modules and Systems影响因子(影响力)<br> http://impactfactor.cn/if/?ISSN=BK0234974<br><br> <br><br>书目名称Conceptual Design of Multichip Modules and Systems影响因子(影响力)学科排名<br> http://impactfactor.cn/ifr/?ISSN=BK0234974<br><br> <br><br>书目名称Conceptual Design of Multichip Modules and Systems网络公开度<br> http://impactfactor.cn/at/?ISSN=BK0234974<br><br> <br><br>书目名称Conceptual Design of Multichip Modules and Systems网络公开度学科排名<br> http://impactfactor.cn/atr/?ISSN=BK0234974<br><br> <br><br>书目名称Conceptual Design of Multichip Modules and Systems被引频次<br> http://impactfactor.cn/tc/?ISSN=BK0234974<br><br> <br><br>书目名称Conceptual Design of Multichip Modules and Systems被引频次学科排名<br> http://impactfactor.cn/tcr/?ISSN=BK0234974<br><br> <br><br>书目名称Conceptual Design of Multichip Modules and Systems年度引用<br> http://impactfactor.cn/ii/?ISSN=BK0234974<br><br> <br><br>书目名称Conceptual Design of Multichip Modules and Systems年度引用学科排名<br> http://impactfactor.cn/iir/?ISSN=BK0234974<br><br> <br><br>书目名称Conceptual Design of Multichip Modules and Systems读者反馈<br> http://impactfactor.cn/5y/?ISSN=BK0234974<br><br> <br><br>书目名称Conceptual Design of Multichip Modules and Systems读者反馈学科排名<br> http://impactfactor.cn/5yr/?ISSN=BK0234974<br><br> <br><br>
伪造者
发表于 2025-3-21 22:43:35
0893-3405 n of complex multichip systems. These activitiesinclude the formalization of design knowledge (information modeling),tradeoff analysis, partitioning, and decision process capture. All ofthese functions occur prior to the traditional CAD activities ofsynthesis and physical design..Inherent in the des
Compatriot
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enumaerate
发表于 2025-3-22 06:51:14
Design Partitioning,commodate varied design constraints, to take advantage of existing components and subsystems, to facilitate parallel development activities, to provide access, to environmentally protect, for testability, for maintainability, and to achieve reconfigurability.
terazosin
发表于 2025-3-22 10:13:22
Introduction,ing involves the critical activities of interconnecting, powering, cooling, and protecting semiconductor chips. The technologies, and materials available for microelectronic packaging are numerous. Figure 1.1 diagrams the electronic module assembly schemes in use today. All methods begin with chips
profligate
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profligate
发表于 2025-3-22 17:50:59
Design Partitioning,n be interconnected using one or more modules, and modules can be placed on one or more backplanes which can in turn be placed into one or more enclosures. Throughout the design of a system, engineers are faced with making decisions about how to divide a system’s functionality. Partitioning is the d
osteocytes
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束以马具
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jet-lag
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978-1-4419-5137-3Springer Science+Business Media New York 1994