GREEN 发表于 2025-3-25 05:22:26

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neutralize 发表于 2025-3-25 08:32:06

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Assignment 发表于 2025-3-25 12:45:41

Seriation, Stratigraphy, and Index Fossilseveral thousands (e.g. in medical technology) to literally billions (e.g. resistor end caps in the electronics industry). Moreover, such micro parts are often produced under severe cost pressure, with the market price for an individual part often being only a fraction of a € cent.

Debrief 发表于 2025-3-25 16:59:49

Process Design,everal thousands (e.g. in medical technology) to literally billions (e.g. resistor end caps in the electronics industry). Moreover, such micro parts are often produced under severe cost pressure, with the market price for an individual part often being only a fraction of a € cent.

夹死提手势 发表于 2025-3-25 20:55:27

Introduction to Collaborative Research Center Micro Cold Forming (SFB 747),iaturisation in many industries. The main boosters for this trend are currently the consumer and communication electronics market and—to a lesser extent—medical technology (especially microfluidic devices, which had a market volume of approx. $2.5B in 2017 [.]).

合法 发表于 2025-3-26 01:49:41

Process Design,l challenges. Generally speaking, in most industries micro production tends to be characterized by mass production, meaning very high lot sizes from several thousands (e.g. in medical technology) to literally billions (e.g. resistor end caps in the electronics industry). Moreover, such micro parts a

consolidate 发表于 2025-3-26 05:05:30

Materials for Micro Forming,drawing are typically made of highly ductile materials such as pure aluminum, copper or stainless steel. Yet these materials are not suited for deep drawing of high strength micro components. Alloys with high mechanical strength are not available as thin foils below 50 µm due to significant strain h

Delirium 发表于 2025-3-26 10:45:30

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初次登台 发表于 2025-3-26 16:23:40

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阐释 发表于 2025-3-26 19:57:44

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查看完整版本: Titlebook: Cold Micro Metal Forming; Research Report of t Frank Vollertsen,Sybille Friedrich,Hans-Werner Zoc Book‘‘‘‘‘‘‘‘ 2020 The Editor(s) (if appli