chiropractor 发表于 2025-3-23 10:15:51

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不理会 发表于 2025-3-23 21:12:29

978-1-4757-4753-9Springer Science+Business Media New York 1995

巨硕 发表于 2025-3-24 02:14:02

X. Q. Yang,A. I. Mees,K. Campbellprocess. It provides a framework to increase the efficiency with which processes can be made manufacturable. I believe this framework should be a prerequisite for all process/equipment engineers who hope to work in the microelectronic industry.

Atheroma 发表于 2025-3-24 06:22:15

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GEM 发表于 2025-3-24 08:30:19

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启发 发表于 2025-3-24 14:08:21

Andrew Eberhard,Robin Hill,Barney M. Gloverme surface. The occurrence of a chemical reaction is central to this means of thin film growth, as is the requirement that the reactants must start out in the vapor phase. Ability to control the components of the gas phase, and the physical conditions of the gas phase, the solid surface, and the env

ODIUM 发表于 2025-3-24 15:26:28

Andrew Eberhard,Robin Hill,Barney M. Gloverth. Conditions during film growth affect many of the properties of thin films. The importance of early stages of thin film growth on the final film properties cannot be overemphasized. In this chapter, we describe the processes that occur during this stage of growth and correlate the growth conditio

音乐会 发表于 2025-3-24 20:55:30

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四海为家的人 发表于 2025-3-25 00:13:55

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查看完整版本: Titlebook: Chemical Vapor Deposition; Thermal and Plasma D Srinivasan Sivaram Book 1995 Springer Science+Business Media New York 1995 chemistry.deposi