LIEN
发表于 2025-3-28 16:07:24
terconnects which can potentially revolutionize the nanoelectronics industry. This book is a must-read for anyone interested in the state-of-the-art on exploiting carbon nanotubes for interconnects for both 2D and 3D integrated circuits.978-3-319-80642-6978-3-319-29746-0
闯入
发表于 2025-3-28 21:31:45
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FLAIL
发表于 2025-3-29 01:53:20
Overview of Carbon Nanotube Interconnectsas a core and foundation of the electronic information technology has a great influence on the daily life of human being. The semiconductor technology and IC industry have become an important symbol to embody a country’s comprehensive scientific and technological capability. In order to improve circ
FATAL
发表于 2025-3-29 04:04:19
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Mangle
发表于 2025-3-29 08:27:12
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BILK
发表于 2025-3-29 12:19:22
Computational Studies of Thermal Transport Properties of Carbon Nanotube Materialshe complex and inherently multiscale nature of the structural organization of the CNT network materials necessitates combination of atomistic and mesoscopic simulation techniques which provide complementary information on different aspects of the heat transfer in CNT materials and facilitate the dev
名次后缀
发表于 2025-3-29 17:04:04
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Invertebrate
发表于 2025-3-29 22:15:51
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CHASM
发表于 2025-3-30 02:46:54
Carbon Nanotubes as Microbumps for 3D Integration enabling future electronics to be consistent with future component, system, and circuit board (or global-level) requirements. Moreover, assembly approaches are moving toward heterogeneous three-dimensional integrated circuits (3D ICs) with silicon via wafer thinning, bonding technologies, and 3D sy