legerdemain
发表于 2025-3-21 19:43:58
书目名称Benefiting from Thermal and Mechanical Simulation in Micro-Electronics影响因子(影响力)<br> http://impactfactor.cn/if/?ISSN=BK0183422<br><br> <br><br>书目名称Benefiting from Thermal and Mechanical Simulation in Micro-Electronics影响因子(影响力)学科排名<br> http://impactfactor.cn/ifr/?ISSN=BK0183422<br><br> <br><br>书目名称Benefiting from Thermal and Mechanical Simulation in Micro-Electronics网络公开度<br> http://impactfactor.cn/at/?ISSN=BK0183422<br><br> <br><br>书目名称Benefiting from Thermal and Mechanical Simulation in Micro-Electronics网络公开度学科排名<br> http://impactfactor.cn/atr/?ISSN=BK0183422<br><br> <br><br>书目名称Benefiting from Thermal and Mechanical Simulation in Micro-Electronics被引频次<br> http://impactfactor.cn/tc/?ISSN=BK0183422<br><br> <br><br>书目名称Benefiting from Thermal and Mechanical Simulation in Micro-Electronics被引频次学科排名<br> http://impactfactor.cn/tcr/?ISSN=BK0183422<br><br> <br><br>书目名称Benefiting from Thermal and Mechanical Simulation in Micro-Electronics年度引用<br> http://impactfactor.cn/ii/?ISSN=BK0183422<br><br> <br><br>书目名称Benefiting from Thermal and Mechanical Simulation in Micro-Electronics年度引用学科排名<br> http://impactfactor.cn/iir/?ISSN=BK0183422<br><br> <br><br>书目名称Benefiting from Thermal and Mechanical Simulation in Micro-Electronics读者反馈<br> http://impactfactor.cn/5y/?ISSN=BK0183422<br><br> <br><br>书目名称Benefiting from Thermal and Mechanical Simulation in Micro-Electronics读者反馈学科排名<br> http://impactfactor.cn/5yr/?ISSN=BK0183422<br><br> <br><br>
Infant
发表于 2025-3-21 20:16:06
http://reply.papertrans.cn/19/1835/183422/183422_2.png
FLAT
发表于 2025-3-22 01:16:42
Simulation in the Industry,orting many Siemens divisions, who are manufacturing assembly boards (PCB). Especially for the new technologies we give support to ensure the product qualities and we help to find out critical manufacturing parameters and to optimize and to qualify components, boards, assembly materials and the manufacturing parameters.
Ablation
发表于 2025-3-22 06:47:54
Polymer Material Characterization and Modeling,view of presently available material models is presented. In particular a cure dependent linear-viscoelastic model is discussed more in detail. With this model the investigation of processing induced stress fields during and after fabrication is possible.
入伍仪式
发表于 2025-3-22 12:12:53
http://reply.papertrans.cn/19/1835/183422/183422_5.png
chastise
发表于 2025-3-22 14:43:13
https://doi.org/10.1007/BFb0006761orting many Siemens divisions, who are manufacturing assembly boards (PCB). Especially for the new technologies we give support to ensure the product qualities and we help to find out critical manufacturing parameters and to optimize and to qualify components, boards, assembly materials and the manu
完整
发表于 2025-3-22 21:06:56
Infinite Dimensional Linear Systems Theorydescription of typical reliability concerns at component and PCB level is given and the effects of temperature on the reliability of microelectronics devices are outlined. The origin of thermomechanically induced stresses is explained and finally, future technology requirements facing the assembly a
蛰伏
发表于 2025-3-22 22:27:16
Ruth F. Curtain,Anthony J. Pritchardof reversible shear tests on flip chip solder joints under isothermal conditions. Two micro shear testers have been designed and built for this task. One tester is optimized to achieve high precision. The second tester works very similar but fits in a UHV chamber. This way, it enables in-situ SEM ob
首创精神
发表于 2025-3-23 05:14:40
http://reply.papertrans.cn/19/1835/183422/183422_9.png
宽容
发表于 2025-3-23 08:02:14
http://reply.papertrans.cn/19/1835/183422/183422_10.png