Odyssey 发表于 2025-3-25 07:15:26

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Ordeal 发表于 2025-3-25 10:30:58

https://doi.org/10.1007/978-3-322-92488-9ven though the practice is not: the quality of a design improves if all of the stakeholders’ interests are considered. This chapter discusses co-design as a process, relating it to the concept of Augmented Materials, outlining the challenges relevant at material- and object-level in creating optimal solutions.

byline 发表于 2025-3-25 12:07:12

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Measured 发表于 2025-3-25 17:14:19

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Juvenile 发表于 2025-3-25 22:34:49

Distributed, Embedded Sensor and Actuator Platformsfew years to explore these emerging technologies. We review some of the largest of these, including a review of the current wireless sensor integration technologies. This chapter will also look more closely at some of the more well-known wireless motes that are being used as toolkits for research, development and field trials.

不能逃避 发表于 2025-3-26 03:09:33

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持久 发表于 2025-3-26 07:00:02

Co-Design: From Electronic Substrates to Smart Objectsven though the practice is not: the quality of a design improves if all of the stakeholders’ interests are considered. This chapter discusses co-design as a process, relating it to the concept of Augmented Materials, outlining the challenges relevant at material- and object-level in creating optimal solutions.

instructive 发表于 2025-3-26 11:12:43

Book 2008ryday objects, particularly the requirements for integrated computation and MEMs sensors, System-in-a-package solutions, multi-chip modules, the impact of the trend towards embedded microelectronic electronics sub-systems, novel assembly techniques for autonomous MEMs sensors, as well as practical p

发酵剂 发表于 2025-3-26 13:39:14

An Overview of Pervasive Computing Systemssibility of integrating IT services directly into users’ lives and activities is very attractive, opening-up new application areas. But how has the field developed? What have been the most influential ideas and projects? What research questions remain open? What are the barriers to real-world deploy

cortex 发表于 2025-3-26 19:10:57

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查看完整版本: Titlebook: Ambient Intelligence with Microsystems; Augmented Materials Kieran Delaney Book 2008 Springer-Verlag US 2008 CompTIA RFID+.Internet of Thi