Carminative
发表于 2025-3-25 03:20:52
https://doi.org/10.1007/978-1-4899-7309-2circuit; electronic circuit; electronics
提升
发表于 2025-3-25 07:57:37
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步履蹒跚
发表于 2025-3-25 12:43:44
Overview: 978-1-4899-7296-5978-1-4899-7309-2
察觉
发表于 2025-3-25 18:00:30
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strdulate
发表于 2025-3-25 23:26:36
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粗鲁的人
发表于 2025-3-26 03:23:43
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脱离
发表于 2025-3-26 07:23:30
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bizarre
发表于 2025-3-26 10:55:04
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AER
发表于 2025-3-26 12:44:28
Xin Ren,Kai Dong,Rong Zhu,Lingzhi YangC (.module Digital Processor And Computer). As a by-product of the MICROPAC program, equipment design techniques for the economical mounting and interconnection of and heat transfer from digital micromodules have been developed and are described herein. It is shown that the circuitry booklet techniq
船员
发表于 2025-3-26 19:45:23
https://doi.org/10.1007/978-3-030-99881-3of −34° to 150°C and a typical package, 12 by 8 by 6 in., were used. Containers should be fabricated from wrought metals drawn to shape or machined from a solid wrought block. If joints are welded, the materials should be carefully selected to minimize porosity and the development of residual stress