陶器
发表于 2025-3-23 11:09:43
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Spinal-Tap
发表于 2025-3-23 17:27:51
Atilade A. Oladunni,Mofoluwake M. IsholaAs explained in the previous section, transfer packaging is one of interesting MEMS packaging technologies because it doesn’t have process compatibility issues with main MEMS process. Thus, the different transfer techniques will be thoroughly explained in the following
chalice
发表于 2025-3-23 20:34:41
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Extemporize
发表于 2025-3-24 01:41:35
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头脑冷静
发表于 2025-3-24 04:50:49
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PANIC
发表于 2025-3-24 10:21:00
https://doi.org/10.1007/978-3-319-77872-3Polymer Packaging cap; Transfer packaging; MEMS packaging; Surface modification; Wafer-level
傲慢人
发表于 2025-3-24 12:32:09
978-3-030-08561-2Springer International Publishing AG 2018
Integrate
发表于 2025-3-24 14:52:16
Advanced Packaging and Manufacturing Technology Based on Adhesion Engineering978-3-319-77872-3Series ISSN 1860-5168 Series E-ISSN 2196-1735
Blazon
发表于 2025-3-24 22:43:40
Constantine Mavroudis,Allison Siegeldebonding. The anti-adhesion coating, principally implemented by SAM (Self-Aligned Monolayer), is different from the thin-film coating explained in the previous section as it depends on chemical chains attached to Si substrate.
Finasteride
发表于 2025-3-24 23:34:57
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