electrolyte 发表于 2025-3-25 05:20:40

Xinghua Lu,W. Jim Zheng,Yusuf A. Hannunmponents of hard materials and complicated shapes. The need to develop finishing processes with wider bounds of application areas, better quality performance, higher productivity, and automatic operation has led to the development of nano-finishing processes.

我怕被刺穿 发表于 2025-3-25 07:39:52

http://reply.papertrans.cn/15/1460/145991/145991_22.png

出价 发表于 2025-3-25 11:44:44

http://reply.papertrans.cn/15/1460/145991/145991_23.png

molest 发表于 2025-3-25 18:33:15

http://reply.papertrans.cn/15/1460/145991/145991_24.png

非秘密 发表于 2025-3-25 20:22:30

http://reply.papertrans.cn/15/1460/145991/145991_25.png

modifier 发表于 2025-3-26 02:00:06

Springer Series in Advanced Manufacturinghttp://image.papertrans.cn/a/image/145991.jpg

consent 发表于 2025-3-26 05:31:19

Jeffrey A. Stuart,Ellen L. Robbximately 20–30% of the value of all goods and services produced. A country’s level of manufacturing activity is directly related to its economic health. In general, the higher the level of manufacturing activity in a country, the higher the standard of living of its people.

政府 发表于 2025-3-26 10:41:38

http://reply.papertrans.cn/15/1460/145991/145991_28.png

FILTH 发表于 2025-3-26 16:05:27

Robert Bittman,Antonio Gomez-MuñozFig. .. A stream of small abrasive particles is introduced and entrained in the water jet in such a manner that water jet’s momentum is partly transferred to the abrasive particles. The process thus combines the benefit of the two other advanced machining processes namely, WJM and AJM. This process

割让 发表于 2025-3-26 19:14:59

Xinghua Lu,W. Jim Zheng,Yusuf A. Hannunnufacturing of precision parts involves final finishing operations, which frequently demand as much as 15% of the total manufacturing cost. The dimensional and alignment accuracy and quality of surface finish are taken care of by finishing processes such as grinding, lapping, honing, and super-finis
页: 1 2 [3] 4
查看完整版本: Titlebook: Advanced Modeling and Optimization of Manufacturing Processes; International Resear R. Venkata Rao Book 2011 Springer-Verlag London 2011 CP