路标 发表于 2025-3-23 11:05:34
http://reply.papertrans.cn/15/1460/145901/145901_11.pngoverwrought 发表于 2025-3-23 15:03:44
Back Matterstrained or inappropriate development, and urban sprawl are promoted unabated. Polar regions play a major role in the global agenda as they are rich in oil and other resources, marking them for contamination, o978-4-431-54672-6978-4-431-54006-9Indurate 发表于 2025-3-23 19:45:59
1437-0387 he fundamentals of heat transfer, component design guidelines, materials selection and assessment, air, liquid, and thermoelectric cooling, characterization techniques and methodology, processing and manufactur978-1-4614-2792-6978-1-4419-7759-5Series ISSN 1437-0387 Series E-ISSN 2197-6643在驾驶 发表于 2025-3-24 00:24:07
http://reply.papertrans.cn/15/1460/145901/145901_14.png不来 发表于 2025-3-24 03:04:46
Book 2011ensive approach to advanced thermal management in electronic packaging, with coverage of the fundamentals of heat transfer, component design guidelines, materials selection and assessment, air, liquid, and thermoelectric cooling, characterization techniques and methodology, processing and manufacturGLIB 发表于 2025-3-24 07:14:44
http://reply.papertrans.cn/15/1460/145901/145901_16.pngindoctrinate 发表于 2025-3-24 10:58:57
Xingcun Colin TongCovers ceramics and glasses, polymers, metals, metallic composites, multi-material laminates, carbonaceous materials, and carbon-matrix composites.Provides the reader with a comprehensive understandin制造 发表于 2025-3-24 18:25:45
Springer Series in Advanced Microelectronicshttp://image.papertrans.cn/a/image/145901.jpgValves 发表于 2025-3-24 21:18:37
Advanced Materials for Thermal Management of Electronic Packaging978-1-4419-7759-5Series ISSN 1437-0387 Series E-ISSN 2197-6643打包 发表于 2025-3-25 00:03:59
https://doi.org/10.1007/978-1-4419-7759-5Thermal managing design guide; Thermal managing fundamentals; Thermally conductive materials; Thermoele