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吞下 发表于 2025-3-30 23:24:58

rastic difference between IC fabrication and power electronic packaging, the book systematically introduces typical power electronic packaging design, assembly, reliability and failure analysis and material selection so readers can clearly understand each task‘s unique characteristics. Power electro
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查看完整版本: Titlebook: Advanced Geostatistics in the Mining Industry; Proceedings of the N Massimo Guarascio,Michel David,Charles Huijbregts Conference proceeding