Animosity
发表于 2025-3-21 18:14:10
书目名称Additive Manufacturing Processes影响因子(影响力)<br> http://figure.impactfactor.cn/if/?ISSN=BK0144818<br><br> <br><br>书目名称Additive Manufacturing Processes影响因子(影响力)学科排名<br> http://figure.impactfactor.cn/ifr/?ISSN=BK0144818<br><br> <br><br>书目名称Additive Manufacturing Processes网络公开度<br> http://figure.impactfactor.cn/at/?ISSN=BK0144818<br><br> <br><br>书目名称Additive Manufacturing Processes网络公开度学科排名<br> http://figure.impactfactor.cn/atr/?ISSN=BK0144818<br><br> <br><br>书目名称Additive Manufacturing Processes被引频次<br> http://figure.impactfactor.cn/tc/?ISSN=BK0144818<br><br> <br><br>书目名称Additive Manufacturing Processes被引频次学科排名<br> http://figure.impactfactor.cn/tcr/?ISSN=BK0144818<br><br> <br><br>书目名称Additive Manufacturing Processes年度引用<br> http://figure.impactfactor.cn/ii/?ISSN=BK0144818<br><br> <br><br>书目名称Additive Manufacturing Processes年度引用学科排名<br> http://figure.impactfactor.cn/iir/?ISSN=BK0144818<br><br> <br><br>书目名称Additive Manufacturing Processes读者反馈<br> http://figure.impactfactor.cn/5y/?ISSN=BK0144818<br><br> <br><br>书目名称Additive Manufacturing Processes读者反馈学科排名<br> http://figure.impactfactor.cn/5yr/?ISSN=BK0144818<br><br> <br><br>
TAIN
发表于 2025-3-21 20:13:15
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Cupping
发表于 2025-3-22 03:21:47
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deciduous
发表于 2025-3-22 05:04:13
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patriarch
发表于 2025-3-22 09:38:23
Kambiz Soltaninejad,Shahin Shadniaesources for product development, classification of AM processes suggests the development of new AM processes that will utilize untapped resources in new way. These new processes could be particle bed process, non-photopolymer bed process and sheet bed process which are given.
NICE
发表于 2025-3-22 14:03:01
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不能强迫我
发表于 2025-3-22 20:50:46
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复习
发表于 2025-3-22 23:47:47
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Fibroid
发表于 2025-3-23 01:48:37
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鲁莽
发表于 2025-3-23 06:47:50
Mahmood Sadeghi,Beeta Balali-Moodution. These processes have potential to be applied in the area of fabricating electronic lines and parts having micropores. This chapter describes these air based and ion based processes and explains why electrolytic solution based AM processes have potential to overcome manufacturing problems posed by layer upon layer processes.