negligence
发表于 2025-3-30 11:19:46
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invade
发表于 2025-3-30 15:45:20
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同谋
发表于 2025-3-30 20:19:25
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OGLE
发表于 2025-3-30 20:50:29
https://doi.org/10.1007/978-3-663-04183-2 the boundaries. In the nondestructive material evaluation, the problem of reverberation arises frequently. In fact some structures by their very nature are so reverberant that the reverberations comprise the entire received signal. A practical example of such a problem occurs in connection with the
过于光泽
发表于 2025-3-31 02:26:32
Aufgaben aus der Technischen Mechaniktude of the reflected signal. Measuring the phase gives a great deal more information. For one thing, the phase is very sensitive to height variations. Measuring the phase also gives us the ability to do signal processing on the resulting images, such as removing the effects of surface features from
令人作呕
发表于 2025-3-31 07:09:15
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情感
发表于 2025-3-31 10:41:44
Aufgaben aus der Technischen Mechanikum plate using Scanning Laser Acoustic Microscopy (SLAM), high-resolution, 60 MHz, ultrasonic images. A principle advantage of the SLAM technique is that it combines a video scan rate with a high scan density (130 lines/mm at 60 MHz). To automate the inspection system we integrated under computer co
jeopardize
发表于 2025-3-31 13:47:49
Aufgaben aus der Technischen Mechaniks (ICs) which make up computers. In order to assure this high reliability, a reliable and inexpensive method for the nondestructive evaluation (NDE) of IC packages is needed. Radiographic analysis of plastic packages, primarily used for the location of bond wires and the evaluation of die attach mat
humectant
发表于 2025-3-31 18:18:58
Aufgaben aus der Technischen Mechanikesion of the die is critical in order to provide both mechanical stability of the component and uniform heat dissipation in the circuit. Voids or disbonds at the die attach interface reduce the power dissipation capability which can result in interruption of the proper operation of the component. Th
evaculate
发表于 2025-4-1 00:13:00
Aufgaben aus der Technischen Mechaniknetic circuit in an electromechanical code interrogation device. Cracking of the ferrites during processing and assembly emerged as a significant manufacturing problem. Operations such as grinding, metallization, joining, and welding were suspected of causing damage, and acoustic microscopy was used