表示向前
发表于 2025-3-23 11:06:58
Jerry Rosiek,Ronald A. Beghettopproach for these two OBC components is a common design for the printed circuit boards of both board types, just with differing chip population. Both of these board types are available with singleredundancy inside the OBC and are connected to the two OBC Processor-Boards via cross coupled SpaceWire
AVID
发表于 2025-3-23 15:36:48
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FLEET
发表于 2025-3-23 20:08:19
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渗透
发表于 2025-3-23 23:33:19
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孤独无助
发表于 2025-3-24 02:29:16
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Sad570
发表于 2025-3-24 08:59:31
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一夫一妻制
发表于 2025-3-24 14:37:49
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ostracize
发表于 2025-3-24 16:48:14
Andrzej Grządziela,Marcin Kluczyk,Pero VidanThe mechanical structure and thermal system of the OBC was designed by the IRS. With this approach it was possible to find a configuration of the OBC housing and electronics as compact as possible and well adapted to the FLP target spacecraft.
秘方药
发表于 2025-3-24 22:18:58
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Afflict
发表于 2025-3-24 23:56:00
A Combined Data and Power Management Infrastructure978-3-642-35557-8Series ISSN 1869-1730 Series E-ISSN 1869-1749