半导体 发表于 2025-3-25 05:16:32

Submitted on: 10 July 2016.
Revised on: 10 September 2016.
Accepted on: 16 October 2016.

___________________AMERICAN JOURNAL OF EVALUATION

HPA533 发表于 2025-3-25 11:26:36

Submitted on: 27 December 2006.
Revised on: 09 February 2007.
Accepted on: 07 March 2007.

___________________AMERICAN JOURNAL OF EVALUATION

没收 发表于 2025-3-25 12:42:24

Submitted on: 13 May 2005.
Revised on: 24 August 2005.
Accepted on: 29 September 2005.

___________________AMERICAN JOURNAL OF EVALUATION

不合 发表于 2025-3-25 17:44:11

http://reply.papertrans.cn/1/14/1330/1330-24.png

Certainty 发表于 2025-3-26 00:01:34

http://reply.papertrans.cn/1/14/1330/1330-25.png

壮丽的去 发表于 2025-3-26 02:50:24

http://reply.papertrans.cn/1/14/1330/1330-26.png

伪书 发表于 2025-3-26 04:47:22

http://reply.papertrans.cn/1/14/1330/1330-27.png

MINT 发表于 2025-3-26 09:55:36

http://reply.papertrans.cn/1/14/1330/1330-28.png

刺耳 发表于 2025-3-26 15:19:59

Submitted on: 21 July 2006.
Revised on: 08 September 2006.
Accepted on: 18 October 2006.

___________________AMERICAN JOURNAL OF EVALUATION

退出可食用 发表于 2025-3-26 20:29:52

Submitted on: 12 August 2023.
Revised on: 02 November 2023.
Accepted on: 28 November 2023.

___________________AMERICAN JOURNAL OF EVALUATION
页: 1 2 [3] 4
查看完整版本: SSCI期刊AMERICAN JOURNAL OF EVALUATION 2024/2025影响因子:1.118 (AM J EVAL) (1098-2140). (SOCIAL SCIENCES, INTERDISCIPLINARY)(