Neogamist
发表于 2025-3-21 18:07:57
SCIE(SCI)期刊INFORMACIJE MIDEM-JOURNAL OF MICROELECTRONICS ELECTRONIC COMPONENTS AND MATERIALS(20 21 REV HIST)影响因子<br> http://figure.impactfactor.cn/if/?ISSN=0352-9045<br><br> SCIE(SCI)期刊INFORMACIJE MIDEM-JOURNAL OF MICROELECTRONICS ELECTRONIC COMPONENTS AND MATERIALS(INFORM MIDEM)影响因子@(工程,电气和电子)学科排名<br> http://figure.impactfactor.cn/ifr/?ISSN=0352B9045<br><br> SCIE(SCI)期刊INFORMACIJE MIDEM-JOURNAL OF MICROELECTRONICS ELECTRONIC COMPONENTS AND MATERIALS(20 21 REV HIST)总引论文<br> http://figure.impactfactor.cn/at/?ISSN=0352-9045<br><br> SCIE(SCI)期刊INFORMACIJE MIDEM-JOURNAL OF MICROELECTRONICS ELECTRONIC COMPONENTS AND MATERIALS(INFORM MIDEM)总引论文@(工程,电气和电子)学科排名<br> http://figure.impactfactor.cn/atr/?ISSN=0352B9045<br><br> SCIE(SCI)期刊INFORMACIJE MIDEM-JOURNAL OF MICROELECTRONICS ELECTRONIC COMPONENTS AND MATERIALS(20 21 REV HIST)影响因子<br> http://figure.impactfactor.cn/tc/?ISSN=0352-9045<br><br> SCIE(SCI)期刊INFORMACIJE MIDEM-JOURNAL OF MICROELECTRONICS ELECTRONIC COMPONENTS AND MATERIALS(INFORM MIDEM)总引频次@(工程,电气和电子)学科排名<br> http://figure.impactfactor.cn/tcr/?ISSN=0352B9045<br><br> SCIE(SCI)期刊INFORMACIJE MIDEM-JOURNAL OF MICROELECTRONICS ELECTRONIC COMPONENTS AND MATERIALS(20 21 REV HIST)即时影响因子<br> http://figure.impactfactor.cn/ii/?ISSN=0352-9045<br><br> SCIE(SCI)期刊INFORMACIJE MIDEM-JOURNAL OF MICROELECTRONICS ELECTRONIC COMPONENTS AND MATERIALS(INFORM MIDEM)即时影响因子@(工程,电气和电子)学科排名<br> http://figure.impactfactor.cn/iir/?ISSN=0352B9045<br><br> SCIE(SCI)期刊INFORMACIJE MIDEM-JOURNAL OF MICROELECTRONICS ELECTRONIC COMPONENTS AND MATERIALS(20 21 REV HIST)五年累积影响因子<br> http://figure.impactfactor.cn/5y/?ISSN=0352-9045<br><br> SCIE(SCI)期刊INFORMACIJE MIDEM-JOURNAL OF MICROELECTRONICS ELECTRONIC COMPONENTS AND MATERIALS(INFORM MIDEM)五年累积影响因子@(工程,电气和电子)学科排名<br> http://figure.impactfactor.cn/5yr/?ISSN=0352B9045<br><br>
单独
发表于 2025-3-21 23:15:31
http://reply.papertrans.cn/2/126/12532/12532-2.png
统治人类
发表于 2025-3-22 02:27:53
http://reply.papertrans.cn/2/126/12532/12532-3.png
Strength
发表于 2025-3-22 06:46:44
Submitted on: 01 May 2007.
Revised on: 12 August 2007.
Accepted on: 05 October 2007.
___________________INFORMACIJE MIDEM-JOURNAL OF MICROELECTRONICS ELECTRONIC COMPONENTS AND MATERIALS
Brochure
发表于 2025-3-22 10:52:13
Submitted on: 17 November 2011.
Revised on: 08 January 2012.
Accepted on: 27 February 2012.
___________________INFORMACIJE MIDEM-JOURNAL OF MICROELECTRONICS ELECTRONIC COMPONENTS AND MATERIALS
CRUMB
发表于 2025-3-22 15:12:58
http://reply.papertrans.cn/2/126/12532/12532-6.png
沙草纸
发表于 2025-3-22 21:06:10
http://reply.papertrans.cn/2/126/12532/12532-7.png
crockery
发表于 2025-3-23 00:31:54
Submitted on: 17 August 2016.
Revised on: 27 November 2016.
Accepted on: 04 January 2017.
___________________INFORMACIJE MIDEM-JOURNAL OF MICROELECTRONICS ELECTRONIC COMPONENTS AND MATERIALS
你不公正
发表于 2025-3-23 02:24:26
http://reply.papertrans.cn/2/126/12532/12532-9.png
截断
发表于 2025-3-23 07:51:04
Submitted on: 10 August 2001.
Revised on: 13 October 2001.
Accepted on: 26 October 2001.
___________________INFORMACIJE MIDEM-JOURNAL OF MICROELECTRONICS ELECTRONIC COMPONENTS AND MATERIALS