投射技术 发表于 2025-3-21 16:22:21

        SCIE(SCI)期刊IEEE Transactions on Components Packaging and Manufacturing Technology(20 21 REV HIST)影响因子<br>        http://impactfactor.cn/2024/if/?ISSN=2156-3950<br><br>        SCIE(SCI)期刊IEEE Transactions on Components Packaging and Manufacturing Technology(IEEE T COMP PACK MAN)影响因子@(工程，电气和电子)学科排名<br>        http://impactfactor.cn/2024/ifr/?ISSN=2156C3950<br><br>        SCIE(SCI)期刊IEEE Transactions on Components Packaging and Manufacturing Technology(20 21 REV HIST)总引论文<br>        http://impactfactor.cn/2024/at/?ISSN=2156-3950<br><br>        SCIE(SCI)期刊IEEE Transactions on Components Packaging and Manufacturing Technology(IEEE T COMP PACK MAN)总引论文@(工程，电气和电子)学科排名<br>        http://impactfactor.cn/2024/atr/?ISSN=2156C3950<br><br>        SCIE(SCI)期刊IEEE Transactions on Components Packaging and Manufacturing Technology(20 21 REV HIST)影响因子<br>        http://impactfactor.cn/2024/tc/?ISSN=2156-3950<br><br>        SCIE(SCI)期刊IEEE Transactions on Components Packaging and Manufacturing Technology(IEEE T COMP PACK MAN)总引频次@(工程，电气和电子)学科排名<br>        http://impactfactor.cn/2024/tcr/?ISSN=2156C3950<br><br>        SCIE(SCI)期刊IEEE Transactions on Components Packaging and Manufacturing Technology(20 21 REV HIST)即时影响因子<br>        http://impactfactor.cn/2024/ii/?ISSN=2156-3950<br><br>        SCIE(SCI)期刊IEEE Transactions on Components Packaging and Manufacturing Technology(IEEE T COMP PACK MAN)即时影响因子@(工程，电气和电子)学科排名<br>        http://impactfactor.cn/2024/iir/?ISSN=2156C3950<br><br>        SCIE(SCI)期刊IEEE Transactions on Components Packaging and Manufacturing Technology(20 21 REV HIST)五年累积影响因子<br>        http://impactfactor.cn/2024/5y/?ISSN=2156-3950<br><br>        SCIE(SCI)期刊IEEE Transactions on Components Packaging and Manufacturing Technology(IEEE T COMP PACK MAN)五年累积影响因子@(工程，电气和电子)学科排名<br>        http://impactfactor.cn/2024/5yr/?ISSN=2156C3950<br><br>       

轻快走过 发表于 2025-3-21 20:20:58

Submitted on: 12 December 2019.
Revised on: 29 January 2020.
Accepted on: 15 February 2020.

___________________IEEE Transactions on Components Packaging and Manufacturing Technology

敲诈 发表于 2025-3-22 01:29:23

Submitted on: 29 May 2005.
Revised on: 19 June 2005.
Accepted on: 10 July 2005.

___________________IEEE Transactions on Components Packaging and Manufacturing Technology

coagulation 发表于 2025-3-22 07:09:16

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镇痛剂 发表于 2025-3-22 11:15:38

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STALE 发表于 2025-3-22 15:02:06

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否决 发表于 2025-3-22 19:37:13

Submitted on: 08 May 2006.
Revised on: 30 August 2006.
Accepted on: 20 September 2006.

___________________IEEE Transactions on Components Packaging and Manufacturing Technology

cornucopia 发表于 2025-3-23 00:30:58

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Trigger-Point 发表于 2025-3-23 02:22:50

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Foolproof 发表于 2025-3-23 08:30:43

Submitted on: 15 July 2023.
Revised on: 27 September 2023.
Accepted on: 20 October 2023.

___________________IEEE Transactions on Components Packaging and Manufacturing Technology
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