期刊书目 › COMPUTER SCIENCE, HARDWARE & ARCHITECTURE(计算机科学与硬件与架构) › ESCI期刊IEEE Solid-State Circuits Letters 2024/2025影响因子:2.213 (IEEE SOLID-ST CIRC L) (NULL). (COMPUTER SCIENCE, HARDWARE

消耗 发表于 2025-3-23 11:24:13

Submitted on: 10 May 2010.
Revised on: 27 July 2010.
Accepted on: 15 August 2010.

___________________IEEE Solid-State Circuits Letters

headway 发表于 2025-3-23 14:24:59

http://reply.papertrans.cn/2/120/11904/11904-12.png

Ascendancy 发表于 2025-3-23 22:06:19

http://reply.papertrans.cn/2/120/11904/11904-13.png

patriot 发表于 2025-3-23 22:35:43

http://reply.papertrans.cn/2/120/11904/11904-14.png

壕沟 发表于 2025-3-24 04:38:17

http://reply.papertrans.cn/2/120/11904/11904-15.png

placebo 发表于 2025-3-24 08:15:10

Submitted on: 05 March 2009.
Revised on: 02 May 2009.
Accepted on: 25 June 2009.

___________________IEEE Solid-State Circuits Letters

nuclear-tests 发表于 2025-3-24 12:10:17

http://reply.papertrans.cn/2/120/11904/11904-17.png

entitle 发表于 2025-3-24 15:27:23

Submitted on: 24 July 2017.
Revised on: 17 November 2017.
Accepted on: 10 December 2017.

___________________IEEE Solid-State Circuits Letters

爱哭 发表于 2025-3-24 21:01:25

Submitted on: 16 November 2005.
Revised on: 05 January 2006.
Accepted on: 24 January 2006.

___________________IEEE Solid-State Circuits Letters

STENT 发表于 2025-3-24 23:11:24

http://reply.papertrans.cn/2/120/11904/11904-20.png

查看完整版本: ESCI期刊IEEE Solid-State Circuits Letters 2024/2025影响因子:2.213 (IEEE SOLID-ST CIRC L) (NULL). (COMPUTER SCIENCE, HARDWARE