期刊书目 › ENGINEERING, ELECTRICAL & ELECTRONIC(工程，电气和电子) › SCIE期刊IEEE MICROWAVE AND WIRELESS COMPONENTS LETTERS 2024/2025影响因子:2.998 (IEEE MICROW WIREL CO) (1531-1309). (ENGINEERI

树木中 发表于 2025-3-23 13:06:59

Submitted on: 25 December 1998.
Revised on: 23 February 1999.
Accepted on: 24 March 1999.

___________________IEEE MICROWAVE AND WIRELESS COMPONENTS LETTERS

Merited 发表于 2025-3-23 17:44:34

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modish 发表于 2025-3-23 20:08:37

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MODE 发表于 2025-3-23 22:34:40

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UTTER 发表于 2025-3-24 06:10:22

Submitted on: 15 December 2017.
Revised on: 13 April 2018.
Accepted on: 02 May 2018.

___________________IEEE MICROWAVE AND WIRELESS COMPONENTS LETTERS

悦耳 发表于 2025-3-24 09:59:56

Submitted on: 12 January 1998.
Revised on: 01 April 1998.
Accepted on: 16 April 1998.

___________________IEEE MICROWAVE AND WIRELESS COMPONENTS LETTERS

Vertebra 发表于 2025-3-24 14:42:11

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LUMEN 发表于 2025-3-24 18:03:14

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伤心 发表于 2025-3-24 19:26:09

Submitted on: 09 August 2016.
Revised on: 08 November 2016.
Accepted on: 01 December 2016.

___________________IEEE MICROWAVE AND WIRELESS COMPONENTS LETTERS

Ostrich 发表于 2025-3-25 01:42:28

Submitted on: 17 May 2008.
Revised on: 17 June 2008.
Accepted on: 10 July 2008.

___________________IEEE MICROWAVE AND WIRELESS COMPONENTS LETTERS

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