cherub 发表于 2025-3-21 20:09:50

        SCIE(SCI)期刊IEEE Embedded Systems Letters(20 21 REV HIST)影响因子<br>        http://impactfactor.cn/2024/if/?ISSN=1943-0663<br><br>        SCIE(SCI)期刊IEEE Embedded Systems Letters(IEEE EMBED SYST LETT)影响因子@(计算机科学，硬件与架构)学科排名<br>        http://impactfactor.cn/2024/ifr/?ISSN=1943B0663<br><br>        SCIE(SCI)期刊IEEE Embedded Systems Letters(20 21 REV HIST)总引论文<br>        http://impactfactor.cn/2024/at/?ISSN=1943-0663<br><br>        SCIE(SCI)期刊IEEE Embedded Systems Letters(IEEE EMBED SYST LETT)总引论文@(计算机科学，硬件与架构)学科排名<br>        http://impactfactor.cn/2024/atr/?ISSN=1943B0663<br><br>        SCIE(SCI)期刊IEEE Embedded Systems Letters(20 21 REV HIST)影响因子<br>        http://impactfactor.cn/2024/tc/?ISSN=1943-0663<br><br>        SCIE(SCI)期刊IEEE Embedded Systems Letters(IEEE EMBED SYST LETT)总引频次@(计算机科学，硬件与架构)学科排名<br>        http://impactfactor.cn/2024/tcr/?ISSN=1943B0663<br><br>        SCIE(SCI)期刊IEEE Embedded Systems Letters(20 21 REV HIST)即时影响因子<br>        http://impactfactor.cn/2024/ii/?ISSN=1943-0663<br><br>        SCIE(SCI)期刊IEEE Embedded Systems Letters(IEEE EMBED SYST LETT)即时影响因子@(计算机科学，硬件与架构)学科排名<br>        http://impactfactor.cn/2024/iir/?ISSN=1943B0663<br><br>        SCIE(SCI)期刊IEEE Embedded Systems Letters(20 21 REV HIST)五年累积影响因子<br>        http://impactfactor.cn/2024/5y/?ISSN=1943-0663<br><br>        SCIE(SCI)期刊IEEE Embedded Systems Letters(IEEE EMBED SYST LETT)五年累积影响因子@(计算机科学，硬件与架构)学科排名<br>        http://impactfactor.cn/2024/5yr/?ISSN=1943B0663<br><br>       

方便 发表于 2025-3-21 23:24:20

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相符 发表于 2025-3-22 01:38:02

Submitted on: 18 July 1998.
Revised on: 11 August 1998.
Accepted on: 28 September 1998.

___________________IEEE Embedded Systems Letters---IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC

信任 发表于 2025-3-22 08:24:41

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反话 发表于 2025-3-22 10:55:01

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Obligatory 发表于 2025-3-22 14:16:09

Submitted on: 27 September 2009.
Revised on: 19 December 2009.
Accepted on: 10 January 2010.

___________________IEEE Embedded Systems Letters---IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC

CLAN 发表于 2025-3-22 18:18:36

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锉屑 发表于 2025-3-23 00:59:51

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赔偿 发表于 2025-3-23 03:18:15

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使成波状 发表于 2025-3-23 07:38:50

Submitted on: 11 November 2022.
Revised on: 26 January 2023.
Accepted on: 09 March 2023.

___________________IEEE Embedded Systems Letters---IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
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