期刊书目 › TELECOMMUNICATIONS(电信) › SCIE期刊IEEE COMMUNICATIONS MAGAZINE 2024/2025影响因子:8.302 (IEEE COMMUN MAG) (0163-6804). (TELECOMMUNICATIONS)(电信)Science C

Gobble 发表于 2025-3-25 06:55:52

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osteoclasts 发表于 2025-3-25 09:20:03

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接合 发表于 2025-3-25 11:41:41

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debble 发表于 2025-3-25 16:37:33

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ERUPT 发表于 2025-3-25 22:00:11

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上坡 发表于 2025-3-26 03:26:26

Submitted on: 25 November 2002.
Revised on: 19 December 2002.
Accepted on: 02 January 2003.

___________________IEEE COMMUNICATIONS MAGAZINE---IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC

spondylosis 发表于 2025-3-26 07:04:57

Submitted on: 15 July 2012.
Revised on: 07 September 2012.
Accepted on: 21 October 2012.

___________________IEEE COMMUNICATIONS MAGAZINE---IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC

seroma 发表于 2025-3-26 09:33:32

Submitted on: 20 November 2010.
Revised on: 15 March 2011.
Accepted on: 15 April 2011.

___________________IEEE COMMUNICATIONS MAGAZINE---IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC

ensemble 发表于 2025-3-26 15:16:07

Submitted on: 12 February 2006.
Revised on: 12 March 2006.
Accepted on: 28 April 2006.

___________________IEEE COMMUNICATIONS MAGAZINE---IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC

神圣将军 发表于 2025-3-26 17:58:41

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