JAR
发表于 2025-3-21 16:46:11
书目名称Whole Body Hyperthermia: Biological and Clinical Aspects影响因子(影响力)<br> http://figure.impactfactor.cn/if/?ISSN=BK1028063<br><br> <br><br>书目名称Whole Body Hyperthermia: Biological and Clinical Aspects影响因子(影响力)学科排名<br> http://figure.impactfactor.cn/ifr/?ISSN=BK1028063<br><br> <br><br>书目名称Whole Body Hyperthermia: Biological and Clinical Aspects网络公开度<br> http://figure.impactfactor.cn/at/?ISSN=BK1028063<br><br> <br><br>书目名称Whole Body Hyperthermia: Biological and Clinical Aspects网络公开度学科排名<br> http://figure.impactfactor.cn/atr/?ISSN=BK1028063<br><br> <br><br>书目名称Whole Body Hyperthermia: Biological and Clinical Aspects被引频次<br> http://figure.impactfactor.cn/tc/?ISSN=BK1028063<br><br> <br><br>书目名称Whole Body Hyperthermia: Biological and Clinical Aspects被引频次学科排名<br> http://figure.impactfactor.cn/tcr/?ISSN=BK1028063<br><br> <br><br>书目名称Whole Body Hyperthermia: Biological and Clinical Aspects年度引用<br> http://figure.impactfactor.cn/ii/?ISSN=BK1028063<br><br> <br><br>书目名称Whole Body Hyperthermia: Biological and Clinical Aspects年度引用学科排名<br> http://figure.impactfactor.cn/iir/?ISSN=BK1028063<br><br> <br><br>书目名称Whole Body Hyperthermia: Biological and Clinical Aspects读者反馈<br> http://figure.impactfactor.cn/5y/?ISSN=BK1028063<br><br> <br><br>书目名称Whole Body Hyperthermia: Biological and Clinical Aspects读者反馈学科排名<br> http://figure.impactfactor.cn/5yr/?ISSN=BK1028063<br><br> <br><br>
侧面左右
发表于 2025-3-21 23:54:38
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地牢
发表于 2025-3-22 03:29:44
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先行
发表于 2025-3-22 06:57:33
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EWE
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按等级
发表于 2025-3-22 16:17:29
Whole Body Hyperthermia: Biological and Clinical Aspects978-3-642-84596-3
Obstacle
发表于 2025-3-22 18:34:27
978-3-642-84598-7Springer-Verlag Berlin Heidelberg 1992
landmark
发表于 2025-3-22 21:18:47
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情感
发表于 2025-3-23 05:11:45
https://doi.org/10.1007/978-3-642-84596-3Systemic hyperthermia; biophysics; cancer; chemotherapy; clinical trial; hyperthermia; immunotherapy; radia
BACLE
发表于 2025-3-23 06:04:49
Nanoscopically Engineered Polyimides,, best satisfy the requisite properties to survive the thermal, chemical, and mechanical stresses associated with microelectronic fabrication. As more function is demanded of these polymer dielectrics, e.g., low residual thermal stress, adhesion, photosensitivity, and low dielectric constant, it bec