RENAL
发表于 2025-3-30 09:21:09
http://reply.papertrans.cn/103/10202/1020141/1020141_51.png
思想流动
发表于 2025-3-30 16:18:12
http://reply.papertrans.cn/103/10202/1020141/1020141_52.png
Servile
发表于 2025-3-30 18:57:49
Silicon Wafer Hybrids,h the circuit board fabricated on a silicon wafer. Lewis , at the conclusion of his study of package performance, suggests flip-chip, beam lead or tape (TAB) mounting of unpackaged ICs directly on a crystal substrate.. Tewksbury suggested flip-chip mounting of VLSI ICs on silicon wafers, usin
根除
发表于 2025-3-30 23:11:43
Optical Interconnections,s natural to consider alternative approaches to provide communications within a high-performance system. Optical interconnects have received considerable attention – . Already, optical networks are being developed for local area networks to provide high performance networking between compute
OVERT
发表于 2025-3-31 01:32:16
Optical Interconnections,s natural to consider alternative approaches to provide communications within a high-performance system. Optical interconnects have received considerable attention – . Already, optical networks are being developed for local area networks to provide high performance networking between compute
Fortuitous
发表于 2025-3-31 08:53:21
http://reply.papertrans.cn/103/10202/1020141/1020141_56.png
Acclaim
发表于 2025-3-31 10:44:46
Silicon Wafer Hybrids,g a silicon wafer template to allow stacking of substrates and construction of 3-dimensional wafer stacks. Grinberg, Nudd and Etchells also suggested stacked wafers, in this case monolithic WSI circuits for image processing architectures. Extensive effort has been directed at commercial applications of such advanced packaging (e.g. ).
anagen
发表于 2025-3-31 15:32:54
Silicon Wafer Hybrids,g a silicon wafer template to allow stacking of substrates and construction of 3-dimensional wafer stacks. Grinberg, Nudd and Etchells also suggested stacked wafers, in this case monolithic WSI circuits for image processing architectures. Extensive effort has been directed at commercial applications of such advanced packaging (e.g. ).
AWRY
发表于 2025-3-31 19:19:40
http://reply.papertrans.cn/103/10202/1020141/1020141_59.png
Indicative
发表于 2025-3-31 22:39:54
Introduction,ractical constraints are emerging. It is within this future perspective that wafer scale integration emerges as a natural evolution of present device-oriented VLSI chip technologies to future system-oriented wafer-level technologies.