deflate 发表于 2025-3-21 16:29:50

书目名称Wafer Level 3-D ICs Process Technology影响因子(影响力)<br>        http://figure.impactfactor.cn/if/?ISSN=BK1020138<br><br>        <br><br>书目名称Wafer Level 3-D ICs Process Technology影响因子(影响力)学科排名<br>        http://figure.impactfactor.cn/ifr/?ISSN=BK1020138<br><br>        <br><br>书目名称Wafer Level 3-D ICs Process Technology网络公开度<br>        http://figure.impactfactor.cn/at/?ISSN=BK1020138<br><br>        <br><br>书目名称Wafer Level 3-D ICs Process Technology网络公开度学科排名<br>        http://figure.impactfactor.cn/atr/?ISSN=BK1020138<br><br>        <br><br>书目名称Wafer Level 3-D ICs Process Technology被引频次<br>        http://figure.impactfactor.cn/tc/?ISSN=BK1020138<br><br>        <br><br>书目名称Wafer Level 3-D ICs Process Technology被引频次学科排名<br>        http://figure.impactfactor.cn/tcr/?ISSN=BK1020138<br><br>        <br><br>书目名称Wafer Level 3-D ICs Process Technology年度引用<br>        http://figure.impactfactor.cn/ii/?ISSN=BK1020138<br><br>        <br><br>书目名称Wafer Level 3-D ICs Process Technology年度引用学科排名<br>        http://figure.impactfactor.cn/iir/?ISSN=BK1020138<br><br>        <br><br>书目名称Wafer Level 3-D ICs Process Technology读者反馈<br>        http://figure.impactfactor.cn/5y/?ISSN=BK1020138<br><br>        <br><br>书目名称Wafer Level 3-D ICs Process Technology读者反馈学科排名<br>        http://figure.impactfactor.cn/5yr/?ISSN=BK1020138<br><br>        <br><br>

harpsichord 发表于 2025-3-21 22:38:35

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继承人 发表于 2025-3-22 03:51:20

978-1-4419-4562-4Springer-Verlag US 2008

宽敞 发表于 2025-3-22 07:20:00

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Irascible 发表于 2025-3-22 12:44:55

Chuan Seng Tan,Ronald J. Gutmann,L. Rafael ReifFocuses on the foundry-based process technology for the fabrication of 3-D ICs.Discusses the technology platform for pre-packaging wafer level 3-D ICs.Includes chapters contributed by various experts

mastoid-bone 发表于 2025-3-22 13:37:14

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凶残 发表于 2025-3-22 19:12:50

Chuan Seng Tan,Ronald J. Gutmann,L. Rafael Reifarly English society, eschew the word ‘class’ and prefer instead some less politically charged term such as ‘status’.. More recently, R. S. Neale has provided a detailed analysis of similar tendencies.. Yet many involved in the teaching of literature, especially the inter-disciplinary area of litera

indicate 发表于 2025-3-23 00:49:49

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创造性 发表于 2025-3-23 02:38:10

Christopher Petti,S. Brad Herner,Andrew Walkerthere comes another. This one is that one says that the integral shall be the largest or the smallest, instead of saying that its first variation should vanish. The confounding of these, by no means identical, requirements has become so much of a custom that one can hardly ascribe it to the authors

干涉 发表于 2025-3-23 08:11:34

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查看完整版本: Titlebook: Wafer Level 3-D ICs Process Technology; Chuan Seng Tan,Ronald J. Gutmann,L. Rafael Reif Book 2008 Springer-Verlag US 2008 Applications ena