伪证
发表于 2025-3-23 12:22:22
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acquisition
发表于 2025-3-23 17:53:33
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门窗的侧柱
发表于 2025-3-23 21:23:41
https://doi.org/10.1007/978-1-4614-0058-5nclude wafer scale integration or multi-reticle wafer, multi-chip module, and 3-D integration. In this chapter we compared these different schemes in a unified cost analysis framework. Our model takes a few parameters extracted from representative fabrication and evaluates the cost efficiency. Our a
仲裁者
发表于 2025-3-23 23:42:12
Epilogue: The Future of the Disciplinereconfigurable data-path (PipeRench), are re-designed by exploiting fine-grain inter-chip interconnects. The 4th design study involves a 3-D stacked CPU/memory system. The above design cases studies validate the potential of the 2.5-D integration paradigm from a performance point of view.
thrombus
发表于 2025-3-24 02:39:38
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抛射物
发表于 2025-3-24 08:45:24
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Foregery
发表于 2025-3-24 11:13:28
Chinese New Model of Modernization,nvision that the 2.5-D paradigm will be gradually adopted by CPUs, graphic processors, mixed-signal systems, and extremely highperformance applications. The 2.5-D technology would unleash the power to build VLSI applications that are hard to imagine today.
Aerophagia
发表于 2025-3-24 15:05:48
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Cupping
发表于 2025-3-24 22:50:39
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GROSS
发表于 2025-3-25 01:59:41
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