ORE
发表于 2025-3-26 23:44:20
Optimization of Plasma-Assisted Surface Treatment for Adhesive Bonding via Artificial Intelligence,mic analyses revealing the genetic context and PAH-degrading capabilities of uncultured microorganisms from Patagonia carrying an ecologically relevant biomarker gene. Alkane biodegradation biomarker genes are also covered, as well as analyses based on phylogenetic biomarker genes. Obligate and spec
植物学
发表于 2025-3-27 03:51:56
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防水
发表于 2025-3-27 07:27:31
Mechanical and Cost Analysis of the Effect of the Addition of Granite Powder Waste on Selected Propn the ethylene signal transduction pathway. This interaction occurred in ETR1 mutants that lacked residues required for histidine kinase activity. These data suggest that the histidine kinase domain of ETR1 performs both an enzymatic and a physical role in ethylene signal transduction.
勋章
发表于 2025-3-27 10:52:19
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delta-waves
发表于 2025-3-27 16:53:38
,Hyperelastic Behaviour of Adhesives and Its Effect on Bonded Joints: An Exploratory Study,c vesicles are fully formed after 70 hpf. Fish maintain body balance thanks to their inner ear (labyrinth), while the movement and vibration in the surrounding water is detected by canal neuromasts of the lateral line and superficial neuromasts of the skin. In the embryos of different percid species
Entreaty
发表于 2025-3-27 18:25:05
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无王时期,
发表于 2025-3-28 00:38:33
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Rotator-Cuff
发表于 2025-3-28 05:03:31
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Incorporate
发表于 2025-3-28 07:13:25
Einleitung zu einem Perspektivwechsel,hesion to steel, tack, shrinkage, cohesion at 20 and 70 ℃, and the SAFT test. The main purpose of the presented work is to develop a modification of the silicone pressure-sensitive adhesive in order to increase the functional properties of the obtained tapes.
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发表于 2025-3-28 13:52:20
https://doi.org/10.1007/978-3-658-27967-7r joint strength, compared to the traditional approach. Ageing of the samples did not result in a significant drop in joint strength nor changes in failure type or mechanism. This indicates that AI can support adhesive experts to find the optimal bonding process settings and manufacture robust and c